Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

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Co/CoP Nanoparticles Encapsulated Within N, P-Doped Carbon Nanotubes on Nanoporous Metal-Organic Framework Nanosheets for Oxygen Reduction and Oxygen Evolution Reactions

Type:
Journal
Info:
Nanoscale Research Letters (2020) 15:82
Date:
2020-03-30
DOI:
http://dx.doi.org/10.1186/s11671-020-03316-x

Author Information

Name Institution
Xinxin YangShenzhen University
Hongwei MiShenzhen University
Xiangzhong RenShenzhen University
Peixin ZhangShenzhen University
Yongliang LiShenzhen University

Films

Plasma CoOx

Hardware used: PEALD-200A, Jiaxing Kemicro Microelectronic
cobaltacene, bis(cyclopentadienyl)cobalt, Cp2Co
CAS#: 1277-43-6
Where to buy precursor
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 200C

Film/Plasma Properties

Substrates

Notes

1516