Innovative scatterometry approach for self-aligned quadruple patterning (SAQP) process control

Type:
Conference Proceedings
Info:
Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 977807
Date:
2016-02-21
DOI:
http://dx.doi.org/10.1117/12.2220287

Author Information

Name Institution
Anil Gunay-DemirkolIMEC
Efrain Altamirano SanchezIMEC
Stephane HeraudNova Measuring Instruments GmbH
Stephane GodnyIMEC
Anne-Laure CharleyIMEC
Philippe LerayIMEC
Ronen UrenskiNova Measuring Instruments LTD
Oded CohenNova Measuring Instruments LTD
Igor TurovetsNova Measuring Instruments LTD
Shay WolflingNova Measuring Instruments LTD

Films

Plasma SiO2

Hardware used: ASM Eagle XP8
Deposition Temperature Range N/A

Film/Plasma Properties

Substrates

Silicon

Notes

814