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Publication Information

Title: Innovative scatterometry approach for self-aligned quadruple patterning (SAQP) process control

Type: Conference Proceedings

Info: Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 977807

Date: 2016-02-21

DOI: http://dx.doi.org/10.1117/12.2220287

Author Information

Name

Institution

IMEC

IMEC

Nova Measuring Instruments GmbH

IMEC

IMEC

IMEC

Nova Measuring Instruments LTD

Nova Measuring Instruments LTD

Nova Measuring Instruments LTD

Nova Measuring Instruments LTD

Films

Plasma SiO2 using ASM Eagle XP8

Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Substrates

Silicon

Keywords

Notes

814

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