Publication Information

Title: Plasma Enhanced Atomic Layer Deposition of TiCxNy Film with Various Reactive Gases

Type: Journal

Info: ECS Journal of Solid State Science and Technology, 3 (6) P185-P191 (2014)

Date: 2014-04-18

DOI: http://dx.doi.org/10.1149/2.010406jss

Author Information

Name

Institution

Pohang University of Science and Technology (POSTECH)

Pohang University of Science and Technology (POSTECH)

Films

Plasma TiCN using Custom

Deposition Temperature Range N/A

3275-24-9

74-82-8

1333-74-0

Plasma TiCN using Custom

Deposition Temperature Range N/A

3275-24-9

1333-74-0

Plasma TiCN using Custom

Deposition Temperature Range N/A

3275-24-9

7664-41-7

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Work Function

UPS, Ultraviolet Photoemission Spectroscopy

VG Scientific ESCALAB 220iXL

Resistivity, Sheet Resistance

Four-point Probe

Keithley 2400 Source Meter

Thickness

SEM, Scanning Electron Microscopy

JEOL JSM-840A

Chemical Composition, Impurities

XPS, X-ray Photoelectron Spectroscopy

VG Scientific ESCALAB 220iXL

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

GIXRD, Grazing Incidence X-Ray Diffraction

Rigaku D/Max-2500

Flat Band Voltage

C-V, Capacitance-Voltage Measurements

Agilent 4284A LCR Meter

Substrates

SiO2

Keywords

Gate Metal

PEALD Film Development

Notes

NH3 plasma gave decreasing GPC with increasing RF power, while H2/CH4 had increasing GPC with increasing RF power. NH3 grows film without plasma.

1000C 30s post deposition anneal and 450C 30min post metal anneal.

Page P186 discussion of why H2 plasma films have oxygen uptake when exposed to air.

91

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