Publication Information

Title: Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD

Type: Conference Proceedings

Info: ECS Transactions, 33 (12) 125-135 (2010)

Date: 2010-07-08

DOI: http://dx.doi.org/10.1149/1.3501039

Author Information

Name

Institution

State University of New York at Albany

State University of New York at Albany

Air Liquide

Air Liquide

Air Liquide

Air Liquide

Films

Deposition Temperature Range = 85-100C

0-0-0

1333-74-0

Deposition Temperature Range = 60-100C

0-0-0

1333-74-0

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Precursor Characterization

TGA, Thermo Gravimetric Analysis

Unknown

Thickness

SEM, Scanning Electron Microscopy

Carl-Zeiss LEO 1550

Thickness

RBS, Rutherford Backscattering Spectrometry

Unknown

Chemical Composition, Impurities

AES, Auger Electron Spectroscopy

Perkin Elmer 660

Resistivity, Sheet Resistance

Four-point Probe

Signatone QuadPro S-A8

Substrates

SiO2

Keywords

Interconnect

Metallic Thin Films

Notes

719

Disclaimer

I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. I have hundreds of pre-2009 papers yet to add. As a result, the information provided is not perfect and not complete. Don't blame Plasma-ALD-Guy if the use of information on this site does not work out for you. If you know of publications I have missed or a database entry is wrong, send me an email at: plasma-ald-guy@plasma-ald.com

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