Your search for plasma enhanced atomic layer deposition publications using TEL Phoenix CVD cluster tool hardware returned 5 records. If there are too many results, you may want to use the multi-factor search to narrow the results.
|1||Copper-ALD Seed Layer as an Enabler for Device Scaling|
|2||Hydrogen plasma-enhanced atomic layer deposition of copper thin films|
|3||Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications|
|4||The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications|
|5||Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD|
I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. I have hundreds of pre-2009 papers yet to add. As a result, the information provided is not perfect and not complete. Don't blame Plasma-ALD-Guy if the use of information on this site does not work out for you. If you know of publications I have missed or a database entry is wrong, send me an email at: firstname.lastname@example.org
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