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Development of Space Divided PE-ALD System and Process Design for Gap-Fill Process in Advanced Memory Devices
Type:
Journal
Info:
J. Korean Inst. Surf. Eng. Vol.53, No.3, 2020.
Date:
2020-06-29
Author Information
| Name | Institution |
|---|---|
| Baek-Ju Lee | Hanwha Corporation |
| Jae-Soon Hwang | Hanwha Corporation |
| Dong-Won Seo | Hanwha Corporation |
| Jae-Wook Choi | Hanwha Corporation |
Films
Plasma SiO2
Plasma SiO2
Film/Plasma Properties
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Uniformity
Analysis: Ellipsometry
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope
Characteristic: Wet Etch Resistance
Analysis: Custom
Characteristic: Stress
Analysis: -
Substrates
| Si(100) |
Notes
| 1514 |