Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

Contact us for more information.


MABOC, bis(1-dimethylamino-2-methyl-2-butoxy) copper(II), Cu(dmamb)2, CAS# 872130-16-0

Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 2 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer
2Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer