Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

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1,3-diisopropyl-imidazolin-2-ylidene copper hexamethyldisilazide, CAS# 0-0-0

Plasma Enhanced Atomic Layer Deposition Film Publications

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NumberTitle
1Deposition of copper by plasma-enhanced atomic layer deposition using a novel N-Heterocyclic carbene precursor