Ferroelectricity of HfxZr1-xO2 thin films fabricated by 300°C low temperature process with plasma-enhanced atomic layer deposition

Type:
Journal
Info:
Microelectronic Engineering 215 (2019) 111013
Date:
2019-05-25

Author Information

Name Institution
Takashi OnayaMeiji University
Toshihide NabatameNational Institute for Materials Science (NIMS)
Naomi SawamotoMeiji University
Akihiko OhiNational Institute for Materials Science (NIMS)
Norihiko IkedaNational Institute for Materials Science (NIMS)
Takahiro NagataNational Institute for Materials Science (NIMS)
Atsushi OginoMeiji University

Films


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Morphology, Roughness, Topography
Analysis: TEM, Transmission Electron Microscope

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Remanent Polarization
Analysis: P-V, Polarization-Voltage Measurements

Characteristic: Dielectric Constant, Permittivity
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements

Substrates

TiN

Notes

Hf and Zr introduced as a cocktail of TEMAHf and TEMAZr.
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