Publication Information

Title: Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization

Type: Journal

Info: Thin Solid Films 590 (2015) 311 - 317

Date: 2015-05-19

DOI: http://dx.doi.org/10.1016/j.tsf.2015.05.033

Author Information

Name

Institution

Yeungnam University

Yeungnam University

Yeungnam University

Yeungnam University

Korea Aerospace University

Yeungnam University

Films

Plasma TiC using Unknown

Deposition Temperature Range = 200-400C

36945-13-8

1333-74-0

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

XRD, X-Ray Diffraction

PANalytical Xpert PRO MRD X-ray Diffractometer

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

Electron Diffraction

Unknown

Resistivity, Sheet Resistance

Four-point Probe

Unknown

Diffusion Barrier Properties

EDS, EDX, Energy Dispersive X-ray Spectroscopy

Unknown

Substrates

SiO2

Keywords

Diffusion Barrier

Interconnect

Notes

521

Disclaimer

I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. I have hundreds of pre-2009 papers yet to add. As a result, the information provided is not perfect and not complete. Don't blame Plasma-ALD-Guy if the use of information on this site does not work out for you. If you know of publications I have missed or a database entry is wrong, send me an email at: plasma-ald-guy@plasma-ald.com

Follow plasma-ald.com

Follow @PlasmaALDGuy Tweet

Shortcuts



© 2014-2017 plasma-ald.com