Publication Information

Title: Deposition of copper by plasma-enhanced atomic layer deposition using a novel N-Heterocyclic carbene precursor

Type: Journal

Info: Chem. Mater., 2013, 25 (7), pp 1132-1138

Date: 2013-03-14

DOI: http://dx.doi.org/10.1021/cm400215q

Author Information

Name

Institution

Carleton University

Tyndall National Institute, University College Cork

University of Delaware

University of Helsinki

University of Delaware

University of Helsinki

University of Helsinki

Tyndall National Institute, University College Cork

Carleton University

Films

Plasma Cu using Beneq TFS-200

Deposition Temperature Range N/A

0-0-0

1333-74-0

Plasma Cu using Beneq TFS-200

Deposition Temperature Range N/A

0-0-0

1333-74-0

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Precursor Characterization

TGA, Thermo Gravimetric Analysis

Unknown

Chemical Composition, Impurities

EDS, EDX, Energy Dispersive X-ray Spectroscopy

Unknown

Thickness

EDS, EDX, Energy Dispersive X-ray Spectroscopy

Unknown

Thickness

SEM, Scanning Electron Microscopy

Unknown

Morphology, Roughness, Topography

SEM, Scanning Electron Microscopy

Unknown

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

XRD, X-Ray Diffraction

Bruker-AXS APEX CCD diffractometer

Resistivity, Sheet Resistance

Four-point Probe

Unknown

Substrates

Si(100)

Keywords

Copper

Notes

Considerable physical data of the precursors are presented.

The 4,5-dimethyl... precursor did not deposit Cu at the conditions considered while the other precursor did.

Gases purified with an Aeronex GateKeeper and Entegris GateKeeper purifiers.

81

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