High aspect ratio iridescent three-dimensional metal-insulator-metal capacitors using atomic layer deposition
Info:
J. Vac. Sci. Technol. A 33(1), Jan/Feb 2015
Author Information
| Name |
Institution |
| Michael Burke | Tyndall National Institute, University College Cork |
| Alan Blake | Tyndall National Institute, University College Cork |
| Vladamir Djara | Tyndall National Institute, University College Cork |
| Dan O'Connell | Tyndall National Institute, University College Cork |
| Ian M. Povey | Tyndall National Institute, University College Cork |
| Karim Cherkaoui | Tyndall National Institute, University College Cork |
| Scott Monaghan | Tyndall National Institute, University College Cork |
| Jim Scully | Tyndall National Institute, University College Cork |
| Richard Murphy | Tyndall National Institute, University College Cork |
| Paul K. Hurley | Tyndall National Institute, University College Cork |
| Martin E. Pemble | Tyndall National Institute, University College Cork |
| Aidan J. Quinn | Tyndall National Institute, University College Cork |
Films
Film/Plasma Properties
Analysis: C-V, Capacitance-Voltage Measurements
Analysis: C-V, Capacitance-Voltage Measurements
Analysis: Q-V, Quality-Voltage Measurements
Analysis: I-V, Current-Voltage Measurements
Analysis: SEM, Scanning Electron Microscopy
Substrates
Notes
| 30:1 trenches. TiN thinner at bottom. |
| TiN etched with Cl2 which is highly selective to Al2O3. |
| Via to bottom electrode etched with non-selective BCl3 process. |
| 107 |