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Effects of an Al2O3 capping layer on La2O3 deposited by remote plasma atomic layer deposition

Type:
Journal
Info:
J. Mater. Res., Vol. 25, No. 10, Oct 2010
Date:
2010-10-01

Author Information

Name Institution
Yongchan KimHanyang University
Sanghyun WooHanyang University
Hyungchul KimHanyang University
Jaesang LeeHanyang University
Honggyu KimHanyang University
Hyerin LeeHanyang University
Hyeongtag JeonHanyang University

Films

Plasma La2O3


Plasma Al2O3


Film/Plasma Properties

Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope

Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Flat Band Voltage
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: EOT, Equivalent Oxide Thickness
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Dielectric Constant, Permittivity
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Hysteresis
Analysis: C-V, Capacitance-Voltage Measurements

Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements

Characteristic: Breakdown Voltage
Analysis: I-V, Current-Voltage Measurements

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy

Substrates

Silicon

Notes

Substrates pirahna and HF cleaned
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