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Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
Type:
Journal
Info:
J. Vac. Sci. Technol. A 30(2), Mar/Apr 2012
Date:
2012-02-10
Author Information
| Name | Institution |
|---|---|
| Tonmoy Chakraborty | State University of New York at Albany |
| Eric T. Eisenbraun | State University of New York at Albany |
Films
Film/Plasma Properties
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Conformality, Step Coverage
Analysis: FIB, Focused Ion Beam
Characteristic: Morphology, Roughness, Topography
Analysis: STM, Scanning Tunneling Microscopy
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Substrates
| SiO2 |
Notes
| 150C forming gas anneal |
| 71 |