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Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
Type:
Journal
Info:
J. Vac. Sci. Technol. A 27(3), May/Jun 2009
Date:
2009-04-28
Author Information
| Name | Institution |
|---|---|
| Sumit Kumar | State University of New York at Albany |
| Daniel V. Greenslit | State University of New York at Albany |
| Tonmoy Chakraborty | State University of New York at Albany |
| Eric T. Eisenbraun | State University of New York at Albany |
Films
Film/Plasma Properties
Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope
Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Barrier Characteristics
Analysis: TVS, Triangle Voltage Sweep
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Substrates
| SiO2 |
Notes
| Praxair Ru precursor. |
| 118 |