Publication Information

Title: Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers

Type: Journal

Info: Journal of Vacuum Science & Technology B 29, 030605 (2011)

Date: 2011-04-11

DOI: http://dx.doi.org/10.1116/1.3585664

Author Information

Name

Institution

State University of New York at Albany

State University of New York at Albany

State University of New York at Albany

Films

Plasma RuTaN using Custom

Deposition Temperature = 300C

0-0-0

169896-41-7

7664-41-7

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Chemical Composition, Impurities

XPS, X-ray Photoelectron Spectroscopy

Thermo VG-Scientific theta probe

Morphology, Roughness, Topography

SEM, Scanning Electron Microscopy

LEO 1550

Resistivity, Sheet Resistance

Four-point Probe

Signatone SYS-301 resistivity probing system

Images

TEM, Transmission Electron Microscope

FEI Technai F20

Substrates

SiO2

Keywords

Interconnect

Notes

690

Disclaimer

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