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Hydrogen-plasma-assisted hybrid atomic layer deposition of Ir thin film as novel Cu diffusion barrier
Type:
Journal
Info:
Surface & Coatings Technology 211 (2012) 14-17
Date:
2011-10-08
Author Information
| Name | Institution |
|---|---|
| Sang In Song | Korea Institute of Industrial Technology |
| Jong Ho Lee | Korea Institute of Industrial Technology |
| Bum Ho Choi | Korea Institute of Industrial Technology |
| Hong Kee Lee | Korea Institute of Industrial Technology |
| Dong Chan Shin | Chosun University |
| Jin-Wook Lee | Leintec Co., Ltd |
Films
Film/Plasma Properties
Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Substrates
| Si(100) |
Notes
| Not really ALD. Ir precursor mixed with H2 gas during plasma step. |
| 1690 |