Publication Information

Title: Emerging Atomic Layer Deposition (ALD) Processes For Low Thermal Budget Flexible Electronics

Type: Conference Proceedings

Info: ASMC 2015 - SEMI Advanced Semiconductor Manufacturing Conference

Date: 2015-05-03

DOI: http://asmc2015.conferencespot.org/57461-semi-1.2058836/t-001-1.2059455/f-005-1.2059456/a-029-1.2059514/an-029-1.2059515

Author Information

Name

Institution

State University of New York at Albany

State University of New York at Albany

State University of New York at Albany

Films

Deposition Temperature Range = 120-250C

1287-13-4

1277-43-6

7664-41-7

1333-74-0

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Compositional Depth Profiling

XPS, X-ray Photoelectron Spectroscopy

Unknown

Chemical Composition, Impurities

RBS, Rutherford Backscattering Spectrometry

Unknown

Thickness

RBS, Rutherford Backscattering Spectrometry

Unknown

Chemical Composition, Impurities

AES, Auger Electron Spectroscopy

Unknown

Thickness

AES, Auger Electron Spectroscopy

Unknown

Resistivity, Sheet Resistance

Four-point Probe

Unknown

Substrates

SiO2

Keywords

Notes

626

Disclaimer

I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. I have hundreds of pre-2009 papers yet to add. As a result, the information provided is not perfect and not complete. Don't blame Plasma-ALD-Guy if the use of information on this site does not work out for you. If you know of publications I have missed or a database entry is wrong, send me an email at: plasma-ald-guy@plasma-ald.com

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