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Multistep atomic layer deposition process for ultrathin superconducting NbN films with high critical current density on amorphous substrate

Type:
Journal
Info:
Supercond. Sci. Technol. 34 (2021) 085016
Date:
2021-06-11
DOI:
http://dx.doi.org/10.1088/1361-6668/ac0d09

Author Information

Name Institution
Max V. ShibalovRussian Academy of Sciences
A. M. MumlyakovRussian Academy of Sciences
I. V. TrofimovRussian Academy of Sciences
E. R. TimofeevaRussian Academy of Sciences
A. P. SirotinaRussian Academy of Sciences
E. A. PershinaRussian Academy of Sciences
A. M. TagachenkovRussian Academy of Sciences
Y. V. AnufrievRussian Academy of Sciences
E. V. ZenovaRussian Academy of Sciences
N. V. PorokhovRussian Academy of Sciences
Michael A. TarkhovRussian Academy of Sciences

Films

Plasma NbN

Hardware used: Oxford Instruments FlexAL
TBTDEN, Tris(diethylamido)(tert-butylimido)niobium
CAS#: 210363-27-2
NH3, Ammonia
CAS#: 7664-41-7
H2, Hydrogen
CAS#: 1333-74-0
Deposition Temperature = 350C

Film/Plasma Properties

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Diagnostic: -

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Diagnostic: -

Characteristic: Critical Temperature
Analysis: Custom
Diagnostic: Custom

Characteristic: Critical Current Density
Analysis: Custom
Diagnostic: Custom

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Diagnostic: JEOL 2100

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope
Diagnostic: JEOL 2100

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Electron Diffraction
Diagnostic: JEOL 2100

Substrates

SiO2

Notes

1580