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Atomic layer deposition of ultrathin platinum films on tungsten atomic layer deposition adhesion layers: Application to high surface area substrates

Type:
Journal
Info:
J. Vac. Sci. Technol. A 33(1), Jan/Feb 2015
Date:
2014-10-31
DOI:
http://dx.doi.org/10.1116/1.4901459

Author Information

Name Institution
Joel W. ClanceyUniversity of Colorado, Boulder

Films

Thermal Al2O3

Hardware used: Custom Rotary
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
H2O, Water
CAS#: 7732-18-5
Deposition Temperature = 180C

Thermal W

Hardware used: Custom Rotary
Disilane, Si2H6
CAS#: 1590-87-0
WF6, Tungsten Hexafluoride
CAS#: 7783-82-6
Deposition Temperature = 120C

Plasma Pt

Hardware used: Custom Rotary
(Trimethyl)methylcyclopentadienylplatinum, MeCpMe3Pt
CAS#: 94442-22-5
H2, Hydrogen
CAS#: 1333-74-0
Deposition Temperature = 150C

Thermal Al2O3

Hardware used: Custom
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
H2O, Water
CAS#: 7732-18-5
Deposition Temperature = 120C

Thermal W

Hardware used: Custom
Disilane, Si2H6
CAS#: 1590-87-0
WF6, Tungsten Hexafluoride
CAS#: 7783-82-6
Deposition Temperature = 120C

Plasma Pt

Hardware used: Custom
(Trimethyl)methylcyclopentadienylplatinum, MeCpMe3Pt
CAS#: 94442-22-5
H2, Hydrogen
CAS#: 1333-74-0
Deposition Temperature = 120C

Film/Plasma Properties

Substrates

Notes

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