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Atomic Layer Deposition of Cobalt Phosphide for Efficient Water Splitting

Type:
Journal
Info:
Angew. Chem. Int. Ed. 2020, 59, 17172 - 17176
Date:
2020-06-30

Author Information

Name Institution
Haojie ZhangMartin Luther University
Dirk J. HagenMax Planck Institute of Microstructure Physics
Xiaopeng LiDonghua University
Andreas GraffFraunhofer Institute for Microstructure of Materials and Systems IMWS
Frank HeyrothMartin Luther University
Bodo FuhrmannMartin Luther University
Ilya KostanovskiyMax Planck Institute of Microstructure Physics
Stefan L. SchweizerMartin Luther University
Francesco CaddeoMartin Luther University
A. Wouter MaijenburgMartin Luther University
Stuart S. P. ParkinMax Planck Institute of Microstructure Physics
Ralf B. WehrspohnMartin Luther University

Films

Plasma CoP


Plasma CoOx


Plasma Pt


Film/Plasma Properties

Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Morphology, Roughness, Topography
Analysis: TEM, Transmission Electron Microscope

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Electrochemical Performance
Analysis: Linear Sweep Voltammetry

Characteristic: Electrochemical Performance
Analysis: EIS, Electrochemical Impedance Spectroscopy

Characteristic: Photoelectrochemical (PEC) Activity
Analysis: Photoelectrochemical (PEC) Activity

Substrates

Silicon
FTO, F:SnO2

Notes

Most processing details in the supplementary information.
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