About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Direct epitaxial nanometer-thin InN of high structural quality on 4H-SiC by atomic layer deposition

Type:
Journal
Info:
Applied Physics Letters 117, 093101 (2020)
Date:
2020-08-20

Author Information

Name Institution
Chih-Wei HsuLinköping University
Petro DeminskyiLinköping University
Ivan MartinovicLinköping University
Ivan G. IvanovLinköping University
Justinas PalisaitisLinköping University
Henrik PedersenLinköping University

Films

Plasma InN

Hardware used: Picosun R200


CAS#: 7664-41-7

Film/Plasma Properties

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Substrates

4H n-SiC(0001)

Notes

1583