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Plasma enhanced atomic layer deposited platinum thin film on Si substrate with TMA pretreatment

Type:
Journal
Info:
Vacuum, Volume 140, 2017, Pages 139 - 143
Date:
2016-12-10
DOI:
http://dx.doi.org/10.1016/j.vacuum.2016.12.015

Author Information

Name Institution
Mao-Lin ShiFudan University
Jing XuFudan University
Ya-Wei DaiFudan University
Qian CaoFudan University
Lin ChenFudan University
Qing-Qing SunFudan University
Peng ZhouFudan University
Shi-Jin DingFudan University
David Wei ZhangFudan University

Films

Plasma Pt

Hardware used: Picosun R200
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
(Trimethyl)methylcyclopentadienylplatinum, MeCpMe3Pt
CAS#: 94442-22-5
NH3, Ammonia
CAS#: 7664-41-7
Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Diagnostic: -

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: -

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Diagnostic: -

Substrates

Silicon

Notes

959