Inductively coupled plasma sources from Plasma ALD, LLC.


Ideal for plasma enhanced atomic layer deposition and other surface engineering applications.


Contact us for more information.

Atomic layer deposition of platinum with enhanced nucleation and coalescence by trimethylaluminum pre-pulsing

Type:
Journal
Info:
Appl. Phys. Lett. 103, 263115 (2013)
Date:
2013-12-12
DOI:
http://dx.doi.org/10.1063/1.4858964

Author Information

Name Institution
Yoontae HwangUniversity of California - San Diego
Binh-Minh NguyenUniversity of California - San Diego
Shadi A. DayehUniversity of California - San Diego

Films

Plasma Pt

Hardware used: Picosun R200
(Trimethyl)methylcyclopentadienylplatinum, MeCpMe3Pt
CAS#: 94442-22-5
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 300C

Plasma Pt

Hardware used: Picosun R200
(Trimethyl)methylcyclopentadienylplatinum, MeCpMe3Pt
CAS#: 94442-22-5
O2, Oxygen
CAS#: 7782-44-7
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
Deposition Temperature = 300C

Thermal HfO2

Hardware used: Picosun R200
TDMAHf, tetrakis(dimethylamido)hafnium, hafnium dimethylamide, (Me2N)4Hf, also CAS# 19782-68-4
CAS#: 19962-11-9
H2O, Water
CAS#: 7732-18-5
Deposition Temperature = 200C

Film/Plasma Properties

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: -

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: -

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: Kratos Analytical Axis Ultra DLD

Characteristic: Resistivity, Sheet Resistance
Analysis: TLM, Transmission Line Measurement
Diagnostic: -

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Diagnostic: FEI Tecnai G2 F30

Characteristic: Interfacial Layer
Analysis: TEM, Transmission Electron Microscope
Diagnostic: FEI Tecnai G2 F30

Characteristic: Transistor Characteristics
Analysis: -
Diagnostic: -

Substrates

SiO2
HfO2

Notes

Picosun SUNALE R-200 Pt with reduced nucleation delay through TMA prepulse optimization.
170