Barrier Characteristics Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Barrier Characteristics returned 12 record(s).

Number	Title
1	Characteristics of HfN films deposited by using remote plasma-enhanced atomic layer deposition
2	Cathode encapsulation of organic light emitting diodes by atomic layer deposited Al₂O₃ films and Al₂O₃/a-SiN_x:H stacks
3	Pulse plasma assisted atomic layer deposition of W–C–N thin films for Cu interconnects
4	Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
5	Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
6	The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
7	Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
8	Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
9	Low-Temperature Plasma-Assisted Atomic Layer Deposition of Silicon Nitride Moisture Permeation Barrier Layers
10	RT Atomic Layer Deposition of Al₂O₃ By Using Remote Plasma Excited Water Vapor
11	Barrier Characteristics of ZrN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Using Tetrakis(diethylamino)zirconium Precursor
12	Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications