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The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

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Topographically selective deposition

Type:
Journal
Info:
Applied Physics Letters 114, 043101 (2019)
Date:
2019-01-12

Author Information

Name Institution
Ahmad ChakerGrenoble Alps University (UGA)
Christophe ValléeGrenoble Alps University (UGA)
Vincent PesceGrenoble Alps University (UGA)
Samia BelahcenGrenoble Alps University (UGA)
Rémi VallatGrenoble Alps University (UGA)
Rémy GassilloudCEA - LETI MINATEC
Nicolas PossemeCEA - LETI MINATEC
Marceline BonvalotGrenoble Alps University (UGA)
Ahmad BsiesyGrenoble Alps University (UGA)

Films


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Sputter Rate
Analysis: Ellipsometry

Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Selectivity
Analysis: SEM, Scanning Electron Microscopy

Substrates

Silicon

Notes

1485