About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Nanocrystallite Seeding of Metastable Ferroelectric Phase Formation in Atomic Layer-Deposited Hafnia-Zirconia Alloys

Type:
Journal
Info:
ACS Appl. Mater. Interfaces, 2022, 14 (47), pp 53057-53064
Date:
2022-10-25

Author Information

Name Institution
Zhouchangwan YuStanford University
Simarjeet S SainiStanford University
Zhongwei LiuStanford University
Yue-Lin HuangStanford University
Apurva MehtaSLAC National Accelerator Laboratory
John D. BanieckiSLAC National Accelerator Laboratory
Yuen-Yee WongStanford University
Yi-Jen TsaiStanford University
Paul C. McIntyreStanford University

Films


Film/Plasma Properties

Characteristic: Ferroelectricity
Analysis: P-V, Polarization-Voltage Measurements

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy

Substrates

TiN

Notes

1704