About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Low temperature temporal and spatial atomic layer deposition of TiO2 films

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 33, 041512 (2015)
Date:
2015-06-01

Author Information

Name Institution
Morteza AghaeeLappeenranta University of Technology
Philipp S. MaydannikLappeenranta University of Technology
Petri JohanssonTampere University of Technology
Jurkka KuusipaloTampere University of Technology
Mariadriana CreatoreEindhoven University of Technology
Tomáš HomolaMasaryk University
David C. CameronMasaryk University

Films

Thermal TiO2


Thermal TiO2

Hardware used: Beneq TFS-200


CAS#: 10028-15-6

Plasma TiO2


Thermal TiO2


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Refractive Index
Analysis: Ellipsometry

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: -

Substrates

PEN, Polyethylene Napthalate
Si(100)

Notes

370