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Residual chlorine in TiO2 films grown at low temperatures by plasma enhanced atomic layer deposition

Type:
Journal
Info:
Thin Solid Films 628 (2017) 142 - 147
Date:
2017-03-17
DOI:
https://doi.org/10.1016/j.tsf.2017.03.025

Author Information

Name Institution
Iva SaricUniversity of Rijeka
Robert PeterUniversity of Rijeka
Ivna Kavre PiltaverUniversity of Rijeka
Ivana Jelovica BadovinacUniversity of Rijeka
Kresimir SalamonInstitute of Physics
Mladen PetravicUniversity of Rijeka

Films

Plasma TiO2

Hardware used: Beneq TFS-200
TiCl4, Titanium Tetrachloride
CAS#: 7550-45-0
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature Range = 40-250C

Thermal TiO2

Hardware used: Beneq TFS-200
TiCl4, Titanium Tetrachloride
CAS#: 7550-45-0
H2O, Water
CAS#: 7732-18-5
Deposition Temperature Range = 100-250C

Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: -

Characteristic: Chemical Composition, Impurities
Analysis: SIMS, Secondary Ion Mass Spectrometry
Diagnostic: -

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction
Diagnostic: -

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: -

Substrates

Silicon

Notes

Based on poster and paper abstract
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