Low-Temperature Deposition of Aluminum Oxide by Radical Enhanced Atomic Layer Deposition - Thesis Coverage
Author Information
Films
Film/Plasma Properties
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction
Analysis: XRR, X-Ray Reflectivity
Analysis: XRR, X-Ray Reflectivity
Analysis: XRR, X-Ray Reflectivity
Analysis: Spectrophotometry
Analysis: SEM, Scanning Electron Microscopy
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy
Analysis: I-V, Current-Voltage Measurements
Analysis: I-V, Current-Voltage Measurements
Analysis: C-V, Capacitance-Voltage Measurements
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis
Analysis: FTIR, Fourier Transform InfraRed spectroscopy
Analysis: FTIR, Fourier Transform InfraRed spectroscopy
Analysis: FTIR, Fourier Transform InfraRed spectroscopy
Analysis: Spectrophotometry
Analysis: C-V, Capacitance-Voltage Measurements
Substrates
| Glass |
| Silicon |
| ITO |
| Pt |
| Polyethylene |
| Paper |
| Wool |
Notes
| Reference 190 - TMA decomposes at 375C. |
| Plasma source limitations require it to be kept on during the entire run with slow power ramping between high and low powers. |
| Portion of the reactor was replaced by polycarbonate to be compatible with the plasma source. |
| Used Sairem SURF451 surfatron plasma source. |
| 84 |