Plasma-enhanced atomic layer deposition: Correlating O2 plasma parameters and species to blister formation and conformal film growth

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 39, 062402 (2021)
Date:
2021-08-26
DOI:
http://dx.doi.org/10.1116/6.0001094

Author Information

Name Institution
Andreas WerbrouckGhent University
Kevin Van de KerckhoveGhent University
Diederik DeplaGhent University
Dirk PoelmanGhent University
Philippe F. SmetGhent University
Jolien DendoovenGhent University
Christophe DetavernierGhent University

Films

Plasma Al2O3

Hardware used: Custom Remote Inductively Coupled Plasma
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 120C

Plasma Plasma Study

Hardware used: Custom Remote Inductively Coupled Plasma
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic: Ion Energy
Analysis: Ion Energy Analyzer
Diagnostic: Hiden EQP1000

Characteristic: Plasma Species
Analysis: QMS, Quadrupole Mass Spectrometer
Diagnostic: Hiden EQP1000

Characteristic: Plasma Species
Analysis: OES, Optical Emission Spectroscopy
Diagnostic: Ocean Optics QE65000 Spectrometer

Characteristic: Plasma Species
Analysis: OES, Optical Emission Spectroscopy
Diagnostic: Avantes Avaspec-NIRS512-1.7-HSC-EVO

Characteristic: Conformality, Step Coverage
Analysis: Custom
Diagnostic: Custom

Characteristic: Thickness
Analysis: Ellipsometry
Diagnostic: J.A. Woollam M-2000

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: FEI Quanta 200 FEG

Substrates

Silicon

Notes

1664