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The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Synergy Between Plasma-Assisted ALD and Roll-to-Roll Atmospheric Pressure PE-CVD Processing of Moisture Barrier Films on Polymers

Type:
Journal
Info:
Plasma Processes and Polymers, 13(3), 311-315
Date:
2015-08-17

Author Information

Name Institution
Sergey A. StarostinDutch Institute For Fundamental Energy Research (DIFFER)
Wytze KeuningEindhoven University of Technology
Jean-Paul SchalkenEindhoven University of Technology
Mariadriana CreatoreEindhoven University of Technology
Erwin (W.M.M.) KesselsEindhoven University of Technology
Jan B. BouwstraFUJIFILM Manufacturing Europe B.V.
Mauritius C. M. (Richard) van de SandenEindhoven University of Technology
Hindrik W. de VriesDutch Institute For Fundamental Energy Research (DIFFER)

Films

Plasma Al2O3


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: Water Vapor Transmission Rate (WVTR)

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: Calcium Test

Substrates

PEN, Polyethylene Napthalate
SiO2
Silicon
Calcium

Notes

537