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Gas permeation barriers deposited by atmospheric pressure plasma enhanced atomic layer deposition

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 34, 01A114 (2016)
Date:
2015-10-19
DOI:
http://dx.doi.org/10.1116/1.4935337

Author Information

Name Institution
Lukas HoffmannUniversity of Wuppertal
Detlef TheirichUniversity of Wuppertal
Tim HasselmannUniversity of Wuppertal
André RäupkeUniversity of Wuppertal
Daniel SchlammUniversity of Wuppertal
Thomas RiedlUniversity of Wuppertal

Films

Plasma Al2O3

Hardware used: Custom
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 80C

Thermal Al2O3

Hardware used: Beneq TFS-200
Deposition Temperature Range N/A

Thermal TiO2

Hardware used: Beneq TFS-200
Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: Calcium Test
Diagnostic: Custom

Characteristic: Thickness
Analysis: Profilometry
Diagnostic: Dektak

Characteristic: Refractive Index
Analysis: Ellipsometry
Diagnostic: J.A. Woollam M-2000V

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Diagnostic: PANalytical Xpert PRO MPD X-ray Diffractometer

Substrates

Silicon
ITO

Notes

405