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Ag films grown by remote plasma enhanced atomic layer deposition on different substrates

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 34, 01A126 (2016)
Date:
2015-11-10
DOI:
http://dx.doi.org/10.1116/1.4936221

Author Information

Name Institution
Akinwumi A. AmusanOtto-von-Guericke University
Bodo KalkofenOtto-von-Guericke University
Hassan GargouriSentech Instruments GmbH
Klaus WandelSentech Instruments GmbH
Cay PinnowSentech Instruments GmbH
Marco LiskerIHP
Edmund P. BurteOtto-von-Guericke University

Films

Plasma Ag

Hardware used: SENTECH
Ag(FOD)(PEt3), Triethylphosphine (6,6,7,7,8,8,8- heptafluoro-2,2- dimethyl-3,5- octanedionate) silver(I)
CAS#: 165461-74-5
H2, Hydrogen
CAS#: 1333-74-0
Deposition Temperature Range = 70-200C

Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: Physical Electronics PHI 5600 ESCA

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: Veeco Dimension 3100

Characteristic: Adhesion
Analysis: AFM, Atomic Force Microscopy
Diagnostic: Veeco Dimension 3100

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: -

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: -

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: -

Characteristic: Adhesion
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: -

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Diagnostic: -

Characteristic: Adhesion
Analysis: TEM, Transmission Electron Microscope
Diagnostic: -

Characteristic: Morphology, Roughness, Topography
Analysis: TEM, Transmission Electron Microscope
Diagnostic: -

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy
Diagnostic: -

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Diagnostic: CDE ResMap 168

Characteristic: Dielectric Constant, Permittivity
Analysis: Ellipsometry
Diagnostic: SENTECH SE850

Characteristic: Refractive Index
Analysis: Ellipsometry
Diagnostic: SENTECH SE850

Characteristic: Thickness
Analysis: XRF, X-Ray Fluorescence
Diagnostic: Fischerscope X-ray XDV-SDD

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Diagnostic: Bruker/AXS D5000

Substrates

SiO2
TiN
Ti
Co
Ni
W

Notes

410