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Plasma-Enhanced Atomic Layer Deposition of Ni

Type:
Journal
Info:
Japanese Journal of Applied Physics 49 (2010) 05FA11
Date:
2009-12-24
DOI:
http://dx.doi.org/10.1143/JJAP.49.05FA11

Author Information

Name Institution
Han-Bo-Ram LeePohang University of Science and Technology (POSTECH)
Sung-Hwan BangPohang University of Science and Technology (POSTECH)
Woo-Hee KimPohang University of Science and Technology (POSTECH)
Gil-Ho GuPohang University of Science and Technology (POSTECH)
Young-Kuk LeeKorea Research Institute of Chemical Technology
Taek-Mo ChungKorea Research Institute of Chemical Technology
Chang Gyoun KimKorea Research Institute of Chemical Technology
Chan Gyung ParkPohang University of Science and Technology (POSTECH)
Hyungjun KimPohang University of Science and Technology (POSTECH)

Films

Plasma Ni

Hardware used: Quros Plus 150
MABONi, Ni(dmamb)2, bis(dimethylamino-2-methyl-2-butoxo)nickel
CAS#: 942311-35-5
NH3, Ammonia
CAS#: 7664-41-7
Deposition Temperature Range = 150-300C

Plasma Ni

Hardware used: Quros Plus 150
MABONi, Ni(dmamb)2, bis(dimethylamino-2-methyl-2-butoxo)nickel
CAS#: 942311-35-5
H2, Hydrogen
CAS#: 1333-74-0
Deposition Temperature Range = 150-300C

Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: -

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope
Diagnostic: -

Characteristic: Chemical Composition, Impurities
Analysis: ELS, EELS, Electron Energy Loss Spectroscopy
Diagnostic: -

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Diagnostic: -

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: -

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Diagnostic: -

Substrates

Si(001)
SiO2

Notes

Si(001) cleaned in buffered oxide etch + deionized water rinse + N2 drying.
SiO2 cleaned in acetone, isopropyl alcohol, deionized water, and nitrogen drying.
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