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Hot Carrier Filtering in Solution Processed Heterostructures: A Paradigm for Improving Thermoelectric Efficiency

Type:
Journal
Info:
Advanced Materials Volume 26, Issue 17, pages 2755-2761, May 7, 2014
Date:
2014-01-28
DOI:
http://dx.doi.org/10.1002/adma.201304419

Author Information

Name Institution
Yichi ZhangUniversity of California - Santa Barbara (UCSB)

Films

Thermal Al2O3

Hardware used: Oxford Instruments FlexAL
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
H2O, Water
CAS#: 7732-18-5
Deposition Temperature = 300C

Plasma HfO2

Hardware used: Oxford Instruments FlexAL
TEMAHf, tetrakis(ethylmethylamido) Hafnium, hafnium ethylmethylamide, (EtMeN)4Hf
CAS#: 352535-01-4
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature = 100C

Film/Plasma Properties

Substrates

Notes

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