Inductively coupled plasma sources from Plasma ALD, LLC.


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Film Uniformity in Atomic Layer Deposition

Type:
Journal
Info:
Chem. Vap. Deposition 2006, 12, 13-24
Date:
2005-10-05
DOI:
http://dx.doi.org/10.1002/cvde.200500024

Author Information

Name Institution
Kai-Erik ElersASM Microchemistry Oy
Tom BlombergASM Microchemistry Oy
M. PeussaVTI Technologies Oy
B. AitchisonMLD Technologies, LLC
Suvi HaukkaASM Microchemistry Oy
Steven MarcusASM Microchemistry Oy

Films

Plasma TiN

Hardware used: Custom Direct Capacitively Coupled Plasma
TiCl4, Titanium Tetrachloride
CAS#: 7550-45-0
N2, Nitrogen
CAS#: 7727-37-9
H2, Hydrogen
CAS#: 1333-74-0
Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic: Uniformity
Analysis: -
Diagnostic: -

Characteristic: Resistivity, Sheet Resistance
Analysis: -
Diagnostic: -

Substrates

Notes

1307