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High-Quality Cobalt Thin Films by Plasma-Enhanced Atomic Layer Deposition

Type:
Journal
Info:
Electrochemical and Solid-State Letters, 9 (11) G323-G325 (2006)
Date:
2006-07-17

Author Information

Name Institution
Han-Bo-Ram LeePohang University of Science and Technology (POSTECH)
Hyungjun KimPohang University of Science and Technology (POSTECH)

Films

Plasma Co

Hardware used: Custom


CAS#: 7664-41-7

Plasma Co

Hardware used: Custom


CAS#: 7664-41-7

Plasma CoC

Hardware used: Custom


CAS#: 1333-74-0

Plasma CoC

Hardware used: Custom


CAS#: 1333-74-0

Film/Plasma Properties

Characteristic: Thickness
Analysis: Profilometry

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: SIMS, Secondary Ion Mass Spectrometry

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Substrates

Si(001)
SiO2

Notes

1014