About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Three dimensional ALD of TiO2 for in-vivo biomedical sensor applications

Type:
Conference Proceedings
Info:
2015 6th IEEE International Workshop on Advances in Sensors and Interfaces (IWASI)
Date:
2015-06-18

Author Information

Name Institution
S. SchroderTechnische Universität Berlin
O. DoganTechnische Universität Berlin
Jessica SchneidewindSentech Instruments GmbH
G. BertottiTechnische Universität Berlin
S. KeilTechnische Universität Berlin
Hassan GargouriSentech Instruments GmbH
Michael ArensSentech Instruments GmbH
E. BroseTechnische Universität Berlin
J. BrunsTechnische Universität Berlin
D. WolanskyTechnische Universität Berlin
B. TillackTechnische Universität Berlin
S. VassanelliTechnische Universität Berlin
B. SzyszkaTechnische Universität Berlin
R. ThewesTechnische Universität Berlin

Films

Plasma TiO2

Hardware used: SENTECH


CAS#: 7732-18-5

Film/Plasma Properties

Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements

Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements

Substrates

Notes

546