Inductively coupled plasma sources from Plasma ALD, LLC.


Ideal for plasma enhanced atomic layer deposition and other surface engineering applications.


Contact us for more information.

Fabrication and properties of AlN film on GaN substrate by using remote plasma atomic layer deposition method

Type:
Journal
Info:
Electronic Materials Letters, Vol. 5, No. 2 (2009), pp. 83--86
Date:
2009-06-01

Author Information

Name Institution
Kwang-Ho KimCheongju University
No-Won KwakCheongju University
Soo Hong LeeSejong University

Films

Plasma AlN


Film/Plasma Properties

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements

Characteristic: Interface Trap Density
Analysis: C-V, Capacitance-Voltage Measurements

Substrates

GaN

Notes

742