About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Spoof-like plasmonic behavior of plasma enhanced atomic layer deposition grown Ag thin films

Type:
Journal
Info:
APPLIED PHYSICS LETTERS 100, 053106 (2012)
Date:
2011-12-28

Author Information

Name Institution
Sharka M. ProkesU.S. Naval Research Laboratory
Orest J. GlembockiU.S. Naval Research Laboratory
Erin ClevelandU.S. Naval Research Laboratory
Joshua D. CaldwellU.S. Naval Research Laboratory
Edward FoosU.S. Naval Research Laboratory
Jaakko T. NiinistöUniversity of Helsinki
Mikko K. RitalaUniversity of Helsinki

Films


Film/Plasma Properties

Characteristic: Thickness
Analysis: n,k Spectrometry

Characteristic: Microstructure
Analysis: SEM, Scanning Electron Microscopy

Characteristic: SERS
Analysis: SERS, Surface Enhanced Raman Scattering

Characteristic: SERS
Analysis: SERS, Surface Enhanced Raman Scattering

Substrates

Si(100)

Notes

Beneq TFS-200 PEALD Ag thin film plasmonic behavior study.
300