Characteristics of ZrO2 gate dielectric deposited using Zr(t –butoxide) and Zr(NEt2)4 precursors by plasma enhanced atomic layer deposition method
Info:
JOURNAL OF APPLIED PHYSICS, VOLUME 92, NUMBER 9, 1 NOVEMBER 2002
Author Information
Films
Film/Plasma Properties
Analysis: TEM, Transmission Electron Microscope
Analysis: TEM, Transmission Electron Microscope
Analysis: TEM, Transmission Electron Microscope
Analysis: AFM, Atomic Force Microscopy
Analysis: AES, Auger Electron Spectroscopy
Analysis: XPS, X-ray Photoelectron Spectroscopy
Analysis: I-V, Current-Voltage Measurements
Analysis: I-V, Current-Voltage Measurements
Analysis: C-V, Capacitance-Voltage Measurements
Analysis: C-V, Capacitance-Voltage Measurements
Analysis: C-V, Capacitance-Voltage Measurements
Analysis: C-V, Capacitance-Voltage Measurements
Substrates
Notes
| Si(100) substrates received pirahna and HF cleans |
| SiOxNy substrates only received pirahna clean. |
| ZrO2 films received 800C RTA for 10s in N2. |
| 55 |