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Residual stress study of thin films deposited by atomic layer deposition

Type:
Journal
Info:
2017 IEEE 12th International Conference on ASIC (ASICON)
Date:
2017-10-25

Author Information

Name Institution
Zhen ZhuAalto University
Emma SalmiBeneq Oy
Sauli VirtanenBeneq Oy

Films

Plasma SiO2


Plasma Al2O3


Film/Plasma Properties

Characteristic: Film Stress
Analysis: Wafer Curvature

Substrates

Silicon

Notes

Information based on thesis coverage, not the acutal publication
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