About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Moisture barrier properties of thin organic-inorganic multilayers prepared by plasma-enhanced ALD and CVD in one reactor

Type:
Journal
Info:
Nanoscale Research Letters 2014, 9:223
Date:
2014-04-11

Author Information

Name Institution
Tim BulowTechnische Universität Braunschweig
Hassan GargouriSentech Instruments GmbH
Mirko SiebertSentech Instruments GmbH
Rolf RudolphSentech Instruments GmbH
Hans-Hermann JohannesTechnische Universität Braunschweig
Wolfgang KowalskyTechnische Universität Braunschweig

Films

Plasma Al2O3


Film/Plasma Properties

Characteristic: Water Vapor Transmission Rate (WVTR)
Analysis: Calcium Test

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Refractive Index
Analysis: Ellipsometry

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Substrates

PEN, Polyethylene Napthalate

Notes

218