About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Alloyed 2D Metal-Semiconductor Atomic Layer Junctions

Type:
Journal
Info:
Nano Lett., 2016, 16 (3), pp 1890-1895
Date:
2016-02-03
DOI:
http://dx.doi.org/10.1021/acs.nanolett.5b05036

Author Information

Name Institution
Ah Ra KimKorea Institute of Materials Science
Yong Hun KimKorea Institute of Materials Science
Jaewook NamSungkyunkwan University
Hee-Suk ChungKorean Basic Science Institute
Dong Jae KimSungkyunkwan University
Jung-Dae KwonKorea Institute of Materials Science
Sang Won ParkKorea Institute of Materials Science
Jucheol ParkFuture Strategy Research Institute
Sun Young ChoiKorea Institute of Materials Science
Byoung Hun LeeGwanju Institute of Science and Technology (GIST)
Ji Hyeon ParkUniversity of Ulsan
Kyu-Hwan LeeKorea Institute of Materials Science
Dong-Ho KimKorea Institute of Materials Science
Sung Mook ChoiKorea Institute of Materials Science
Pulickel M AjayanRice University
Myung Gwan HahmInha University
Byung-Jin ChoKorea Institute of Materials Science

Films

Plasma Nb2O5

Hardware used: Custom
Niobium Pentafluoride, Niobium(V) fluoride, NbF5
CAS#: 7783-68-8
H2, Hydrogen
CAS#: 1333-74-0
O2, Oxygen
CAS#: 7782-44-7
Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: -

Substrates

WO3

Notes

PEALD details in supplementary information.
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