About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Thermal Stability of Novel Hole-Selective Contacts for Silicon Wafer Solar Cells

Type:
Conference Proceedings
Info:
EU PVSEC 2017
Date:
2017-09-25

Author Information

Name Institution
Chang-Yeh LeeUniversity of New South Wales
Tian ZhangUniversity of New South Wales
Kean KhooUniversity of New South Wales
Amir AbdallahQatar Environment and Energy Research Institute (QEERI)
Sergey RashkeevQatar Environment and Energy Research Institute (QEERI)
Nouar TabetQatar Environment and Energy Research Institute (QEERI)
Bram HoexUniversity of New South Wales

Films

Plasma WO3


Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: FTIR, Fourier Transform InfraRed spectroscopy

Characteristic: Minority Carrier Lifetime
Analysis: QSSPC, Quasi-Steady-State PhotoConductance Decay

Characteristic: Work Function
Analysis: UPS, Ultraviolet Photoemission Spectroscopy

Substrates

Silicon

Notes

1131