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Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu

Type:
Journal
Info:
Journal of Alloys and Compounds, Volume 663, 2016, Pages 651 - 658
Date:
2015-12-20
DOI:
http://dx.doi.org/10.1016/j.jallcom.2015.12.148

Author Information

Name Institution
Yujin JangYeungnam University
Jun Beom KimYeungnam University
Tae Eun HongKorean Basic Science Institute
So Jeong YeoKorea Research Institute of Chemical Technology
Sunju LeeKorea Research Institute of Chemical Technology
Eun Ae JungKorea Research Institute of Chemical Technology
Bo Keun ParkKorea Research Institute of Chemical Technology
Taek-Mo ChungKorea Research Institute of Chemical Technology
Chang Gyoun KimKorea Research Institute of Chemical Technology
Do-Joong LeeBrown University
Han-Bo-Ram LeeIncheon National University
Soo-Hyun KimYeungnam University

Films

Plasma MoN

Hardware used: Unknown
Mo(NtBu)2(StBu)2
CAS#: 0-0-0
H2, Hydrogen
CAS#: 1333-74-0
Deposition Temperature = 300C

Film/Plasma Properties

Characteristic: Thickness
Analysis: -
Diagnostic: -

Characteristic: Conformality, Step Coverage
Analysis: -
Diagnostic: -

Characteristic: Resistivity, Sheet Resistance
Analysis: -
Diagnostic: -

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Diagnostic: -

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Diagnostic: -

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: -

Substrates

SiO2

Notes

487