About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Forming-free metal-oxide ReRAM by oxygen ion implantation process

Type:
Conference Proceedings
Info:
2016 IEEE International Electron Devices Meeting (IEDM)
Date:
2016-12-03

Author Information

Name Institution
Wonjoo KimPeter-Grünberg Institute
Alexander HardtdegenPeter-Grünberg Institute
C. RodenbücherPeter-Grünberg Institute
S. MenzelPeter-Grünberg Institute
Dirk J. WoutersRWTH Aachen University
Susanne Hoffmann-EifertPeter-Grünberg Institute
Dan BucaPeter-Grünberg Institute
R. WaserPeter-Grünberg Institute
Vikas RanaPeter-Grünberg Institute

Films

Plasma HfO2

Hardware used: Unknown


Film/Plasma Properties

Substrates

Notes

1001