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Fast Flexible Plastic Substrate ZnO Circuits

Type:
Journal
Info:
IEEE Electron Device Letters, Vol. 31, No. 4, April 2010
Date:
2010-03-04
DOI:
http://dx.doi.org/10.1109/LED.2010.2041321

Author Information

Name Institution
Dalong ZhaoThe Pennsylvania State University
Devin A. MoureyThe Pennsylvania State University
Thomas N. JacksonThe Pennsylvania State University

Films

Plasma ZnO

Hardware used: Unknown
DEZ, diethyl zinc, ZnEt2
CAS#: 557-20-0
N2O, Nitrous Oxide
CAS#: 10024-97-2
Deposition Temperature Range N/A

Plasma Al2O3

Hardware used: Unknown
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
CO2, Carbon Dioxide
CAS#: 124-38-9
Deposition Temperature Range N/A

Thermal Al2O3

Hardware used: Unknown
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
H2O, Water
CAS#: 7732-18-5
Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic: Leakage Current
Analysis: Custom
Diagnostic: Custom

Characteristic: Mobility
Analysis: I-V, Current-Voltage Measurements
Diagnostic: Custom

Characteristic: Threshold Voltage
Analysis: I-V, Current-Voltage Measurements
Diagnostic: Custom

Characteristic: Subthreshold Slope
Analysis: I-V, Current-Voltage Measurements
Diagnostic: Custom

Characteristic: On/Off Current Ratio
Analysis: I-V, Current-Voltage Measurements
Diagnostic: Custom

Characteristic: Threshold Voltage Shift
Analysis: Custom
Diagnostic: Custom

Substrates

Polyimide

Notes

ZnO patterned in dilute HCl.
Al2O3 patterned in 80C phosphoric acid.
Polyimide substrate glass transition temperature ~354C.
Thermal Al2O3 films used for passivation.
100