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Atomic Layer Deposition of Gold Metal

Type:
Journal
Info:
Chem. Mater.
Date:
2015-12-28
DOI:
http://dx.doi.org/10.1021/acs.chemmater.5b04562

Author Information

Name Institution
Matthew B. E. GriffithsCarleton University
Peter J. PallisterCarleton University
David J. MandiaCarleton University
Sean T. BarryCarleton University

Films

Other Au

Hardware used: Picosun R200
Trimethylphosphino Trimethyl Gold(III), Trimethyl Trimethylphosphine Gold(III)
CAS#: 33012-33-8
O2, Oxygen
CAS#: 7782-44-7
H2O, Water
CAS#: 7732-18-5
Deposition Temperature = 120C

Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: -

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy
Diagnostic: -

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Diagnostic: -

Characteristic: Precursor Characterization
Analysis: TGA, Thermo Gravimetric Analysis
Diagnostic: TA Instruments Q500 with EGA furnace

Characteristic: Precursor Characterization
Analysis: Vapor Pressure
Diagnostic: TA Instruments Q500 with EGA furnace

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: Tescan Vega-II XMU

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: Tescan Vega-II XMU

Substrates

Si(100)
Glass

Notes

443